Abstract
AbstractA cooling system composed of a thermal redistribution layer (TRDL) and a thermal through‐silicon via (TTSV) is proposed for three‐dimensional integrated circuits (3D ICs). According to the Fourier heat flow analysis theory, the heat flow model of the proposed cooling system is established and verified by finite element analysis (FEA). It is shown that the maximum error between the heat flow model and FEA is 2.98%, and the maximum temperature of 3D ICs can be reduced by 4.43°C. The established horizontal heat dissipation channel can effectively solve the heat dissipation problem in 3D ICs.
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Schedule a callMore From: International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
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