Abstract
Adaptive supply voltage as well as adaptive body bias may be used to control the frequency and leakage distribution of fabricated microprocessor dies. Test chip measurements show that adaptive V/sub CC/ is effective in reducing the impact of parameter variations on frequency, active power, and leakage power of microprocessors when 20 mV V/sub CC/ resolution is used. Using adaptive V/sub CC/ together with adaptive V/sub BS/ or within-die body bias is much more effective than using any of them individually.
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