Abstract

AbstractIn recent years, excellent surface passivation has been achieved on both p‐type and n‐type surfaces of silicon wafers and solar cells using aluminum oxide deposited by plasma‐assisted atomic layer deposition. However, alternative deposition methods may offer practical advantages for large‐scale manufacturing of solar cells. In this letter we show that radio‐frequency magnetron sputtering is capable of depositing negatively‐charged aluminum oxide and achieving good surface passivation both on p‐type and n‐type silicon wafers. We thus establish that sputtered aluminum oxide is a very promising method for the surface passivation of high efficiency solar cells. (© 2009 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

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