Effective Corrosion Inhibition of Galvanic Corrosion of Cu Coupled to Au by Sodium Dodecyl Sulfate (SDS) and Polyethylene Glycol (PEG) in Acid Solution

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This study investigates the effects of sodium dodecyl sulfate (SDS) and polyethylene glycol (PEG) on the galvanic corrosion behavior of copper (Cu) coupled to gold (Au) in a printed circuit board (PCB) etching solution. Galvanic corrosion tests using ZRA (zero resistance ammeter) were performed to determine the optimal SDS concentration for corrosion inhibition. The corrosion current between Cu and Au decreased significantly with the addition of SDS, from 3.26 mA/cm2 to 0.248 mA/cm2 at 4 mM SDS, achieving an inhibitor efficiency (IE) of 92.3%. However, at 15 mM SDS, the corrosion current increased, and IE decreased to 80.5%. This phenomenon is attributed to the critical micelle concentration (CMC) of SDS, where surfactant molecules aggregate and reduce surface adsorption properties. Similarly, ZRA tests were conducted to analyze the effects of PEG on galvanic corrosion. The corrosion current significantly decreased with PEG addition, achieving 98.1% IE at 1 g/L and 99.5% IE at 2 g/L. Beyond this concentration, no significant change in IE was observed, indicating saturation. Potentiodynamic polarization tests were also conducted to study the individual effects of SDS and PEG on Cu and Au. The results showed that SDS effectively inhibited Cu corrosion but had a minimal impact on Au. In contrast, PEG significantly reduced the corrosion current density for both Cu and Au, with reductions of 99.5% and 95.1%, respectively.