Abstract
Demand towards smaller electronic devices prompts the electronic interconnection to have less density and minimal weight percentage and such of this concern tips to applications of nanoparticles incorporation to the solder alloy. In this work, the effect of titanium dioxide (TiO2) nanoparticles (<100nm) additions on the performance of wettability micro hardness, and shear strength of the Sn-3.8Ag-0.7Cu (SAC) solder alloy soldered on the Copper (Cu) substrate was investigated. The SAC added 3% TiO2nanoparticles had a slight decrease in the micro hardness compared to the plain SAC in this study but the value still surpasses many other common solder alloy’s hardness value. The wettability test was conducted by taking account the contact angle achieved by soldering the SAC added 3% TiO2solder alloy to the Cu substrate and contact angle produced was less than 40°. As for the shear strength, there was a clear increment of 13% in the shear strength compared to the plain SAC solder alloy. Quite observant, the additions of TiO2nanoparticles displayed significant influence on these properties that contributes to excellent performance. Much detailed discussion are elaborated in the content below aiding with results and theory behind the result achieved.
Highlights
Introduction and LiteratureLead free solders are the current affection in the electronic industry as many governed body have banned the usage of Plumbum (Pb)
As for the shear strength, there was a clear increment of 13% in the shear strength compared to the plain SAC solder alloy
Comparing with the plain SAC and the traditional SnPb solder alloy, the contact angle of latter was lower compared to SAC + 3% TiO2 in this study
Summary
Lead free solders are the current affection in the electronic industry as many governed body have banned the usage of Plumbum (Pb). Nanoparticles additions can be divide in to two types, i) metal nanoparticles (Ag, Cu, Ni, In and etc) and ii) oxide/ceramic nanoparticles (TiO2, SiC, SrTiO3 and etc.), with all these depending on the outcome of the applications [12]. These nanoparticles can influence by effecting the solubility of the solder alloy and taking part in the diffusion process or contrast to that, being a discrete particles and influence in increasing the mechanical strength. This paper involves the additions of nanoparticles in the SnAgCu solder system and investigate the influence of the nanoparticles to the solder alloy
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