Abstract
The purpose of this paper is to understand the combined effect of thermal and mechanical loading on the initiation and behaviour of sub-interface crack in the ceramic. In this study a 2D finite element model has been used to simulated mixed mode crack propagation near the bimaterial interface. The assembly ceramometalic is subjected simultaneously to thermomechanical stress field. The extent of a plastic zone deformation in the vicinity of the crack-tip has a significant influence on the rate of its propagation. The crack growth at the joint specimen under four-point bending (4PB) loading and the influence of residual stresses was also evaluated by the maximum tensile stress criterion. The J-integral at the crack tip is generally expressed by the thermomechanical local stresses. The results obtained show the effect of the temperature gradient ΔT, the size of the crack and the applied stresses on the J-integral.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
