Abstract
The effect of the formation of CuO flowers and SnO2 on tin whiskers formation and growth in 30°C/60%RH environmental condition for tin surface finish had been studied. Immersion plating method was used to coat a layer of tin onto a copper, Cu substrates. The coated surface was subjected to external stress by micro hardness indenter with 2N load in order to simulate an external stress in coating layer and to promote the formation of tin whiskers. FESEM and EDX was used to study the type and chemical composition of whiskers and oxides formed. Image analyser was used to measure the whiskers length using JEDEC Standard No 22-A121A. After 1 week of the exposure under 30°C/60%RH environmental condition, kinked-type whiskers were formed and the whiskers growth were discontinued at week 4 due to the distruction at the end-tip of kinked-type tin whisker to grow further when it touched the coating surface. An obervation until 52 weeks of exposure time found that the formation and growth of CuO flowers and the oxidation of non-kinked-type of tin whiskers to form SnO2 promoted by external stress also contributed to the discontinuity of whiskers growth.
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