Abstract
The effect of the addition of Ce and Si on the hot cracking behavior of SiMn alloy during the solidification process has been studied respectively by scanning electron microscope with energy-dispersive spectroscopy. It was found that a large amount of graphite and SiC particles are scattered in the cracking zones of the original SiMn alloy, which results in hampering of solidification shrinkage of SiMn melt and the stress concentration around the non-metallic inclusions. A small amount addition of Ce had a positive effect on the reduction of hot cracking by grain refining and decreasing the thickness of liquid film. The addition of Si is found to be beneficial on decreasing the hot cracking markedly, which is due to the large reduction of graphite particles and the increasing of eutectic phase in the grain boundary.
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