Abstract
B4C ceramics has potential applications at moderately elevated temperatures (< 450 °C) for semiconductor industry and solar systems due to their high elastic modulus and stability. B4C sintered bodies were joined by Al infiltrated TiC tape at 1000 °C for 0.5 h in vacuum. The mechanical properties in the 20–600 °C temperature range were investigated. B4C joints (267 MPa) show comparable mechanical properties to B4C matrix (271 MPa) at room temperature according to Weibull analysis. The bending strength of B4C joint maintains to be about 250 MPa up to 500 °C and then decreases quickly with further increasing temperature. Microstructural observations on fracture surface suggest that the high-temperature strength is dominated by the softening of Al binder phase in the interlayer.
Published Version
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