Abstract
Oxygen implanted silicon-on-insulator material, SIMOX, (Separation by IMplanted Oxygen) provides improved speed and radiation hardness over bulk silicon for integrated circuits which are built on the thin superficial Si layer above the buried oxide layer. A high quality superficial Si layer is required, but may be degraded by high defect densities of 109 to 1010 cm-2 in annealed SIMOX. Defect densities have been reduced down to 106cm-2 or less. They were achieved with a final high temperature annealing step (1300-1400°C) in conjunction with: a) high temperature implantation or; b) channeling implantation or; c) multiple cycle implantation. The defect structure developed during implantation, which is strongly affected by temperature, plays a significant role in the defect structure in the annealed material. In this work we are reporting on the effect of implantation temperature on defect formation and also some new details on the structure of the defects that are present.
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