Effect of temperature on adhesion behavior of layered piezoelectric structure

Abstract

The effect of temperature on adhesion is neglected in classical adhesive contact theories. However, an increasing number of experimental results indicate that temperature has a prominent effect on adhesion behaviors. In this study, the anisothermal adhesive contact behaviors between two transversely isotropic piezoelectric cylinders with different initial temperatures is investigated by virtue of the generalized JKR model, where the contact interface is assumed to be perfectly bonded. The considered problem is reduced to coupled singular integral equations, which is derived by using the Fourier integral transform. The closed-form solutions of anisothermal generalized stress fields are obtained by taking the series expansion of the integrand induced by temperature difference. The effect of temperature difference on adhesion behaviors of two different types of layered piezoelectric structures under the action of mechanical-electro loadings is revealed. It is found that the pull-off force and contact size at pull-off moment decrease with increasing the temperature difference. The adhesion weakening effect induced by temperature difference diminishes when the electric loading is exerted. The results derived from this paper shed lights on understanding the adhesive contact behaviors of piezoelectric materials in the presence of temperature difference.