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Abstract
We have deposited Cu thin films on a water-resistant paper substrate using magnetron sputtering with multipolar magnetic plasma confinement assisted by inductively coupled plasma and investigated the effects of the substrate negative pulse voltage (Vs) and pulse frequency on the properties of the films. The X-ray diffraction results showed that the intensities of the Cu(111) and Cu(200) peaks depended strongly on both Vs and the pulse frequency. In addition, atomic force microscopy of the surface morphology revealed that increasing Vs in the range from 0 to −120 V resulted in a decrease in the root-mean-square roughness from 13.7 to 9.48 nm.
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