Abstract
The influence of some N-heterocyclic inhibitors on the corrosion behavior of Sn–58Bi alloy and powders in the soldering flux was investigated using electrochemical impedance spectroscopy (EIS), weight loss experiment and scanning electron microscopy (SEM). Results show that the piperidine-based inhibitor (P-1) acts as a good inhibitor on the corrosion of Sn–58Bi solder alloy and powders in the soldering flux. The inhibition efficiency (IE) improves with the increase in P-1 concentration. P-1 inhibitor also shows high protection efficiency for Sn–58Bi alloy corrosion in acid medium when the content of the organic acid increases from 2 wt.% to 6 wt.%. The SEM analysis results manifest that the Sn-rich phase of Sn–58Bi solder alloy is preferentially etched and greatly dissolved in the soldering flux without any inhibitor during immersion, and the addition of P-1 inhibitor can reduce the corrosion process significantly.
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