Abstract
The effects of soldering temperature on wetting characteristics and optical density of dip coated Sn and Sn–3.5Ag solders on Cu substrate were investigated. The wettability of solders was assessed by the wetting balance tester. The temperature of the solder bath varied in the range of 250–300°C. With the increase in temperature, a slight decrease in the surface tension of solders was noticed. The wetting tests demonstrated an increased solderability of pure Sn with temperature compared to Sn-3.5Ag solder. The optimum solderability of each solder was obtained at 270°C. The optical density of both the solders was also found to be highest at 270°C. It is reported that wettability and optical density of a solder are related to each other and can be tailored by varying the soldering temperature.
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