Abstract
Carbon-doped silicon oxide (SiOCH) films were deposited by plasma-enhanced chemical vapor deposition (PECVD) using tetraethoxysilane (TEOS) at low temperatures (27–53 °C). The structural and insulating properties of the films deposited with Ar or N2 plasma were investigated. In the deposition with low plasma density and low substrate temperature, both plasmas produced films with high hydrocarbon (CHn) content. The films prepared using Ar plasma showed a low leakage current of 7×10-10 A/cm2 at 1 MV/cm due to the incorporation of CHn groups, while the films with high CHn content prepared using N2 plasma showed poor insulating properties. The deposition using N2 plasma formed films with a defective structure, resulting in a higher etch rate than that of the films deposited with Ar plasma. The deposition with the low-density plasma of inert Ar gas is suitable for the low-temperature deposition of SiOCH films with high resistivity.
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