Abstract
Pd surface activation via a sonochemical approach was studied by varying Pd precursor status in the aqueous solution. By aging a K2PdCl6 activation solution overnight with added NH4OH, the chlorinated Pd complex was changed to an ammonia-based Pd complex. The Pd surface activation carried out with the NH4OH complexing agent resulted in improved surface condition following Cu electroless deposition. The Cu thin film deposited on a substrate sonochemically activated with the aged, ammonia-based Pd complex showed improved surface roughness and resistivity compared to that for Cu films deposited via two other precursors (chlorinated Pd complex and ammonia-based complex) without aging. In addition, nitrogen purging during sonochemical activation improved Cu film quality.
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