Abstract
Mo and Cu were bonded successfully by means of diffusion bonding using a Ni interlayer. The tensile strength of the joint increases firstly and then decreases with the bonding temperature or holding time increases. Compared with 79 MPa which was the maximum value of Mo/Cu joint, the maximum tensile strength of joint with Ni interlayer was 97 MPa. The interfacial structure of the joints was studied by SEM, EPMA, EDS and XRD, the results showed that the different atoms diffused to each other in the bonding process and no intermetallic compound appeared. Mo Ni and Ni Cu solid solutions formed in the joint. The fracture of the joint had taken place in the Mo/Ni interface rather than in the Ni/Cu interface and the fracture way of the joints was brittle fracture.
Published Version
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