Abstract
PurposeThe purpose of this paper is to focus on the fabrication of SnAgCu (SAC) nanocomposites solder and study the effect of Cu nanopowders (nano-Cu) addition on the microstructure evolution of resultant nanocomposite solder after reflow and thermal aging.Design/methodology/approachMechanical mixing is used in this work to incorporate nanoparticles into the solder and produce more homogeneous mixture. Standard metallographic procedures are applied for microstructural analysis of solder joints.FindingsIt is found that nano-Cu doped into Sn0.7Ag0.5Cu-BiNi solder has no appreciable influence on melting temperature of the composite solder. The addition of Cu nanoparticles refines the microstructure of bulk solder and suppresses the growth of interfacial intermetallic compound (IMC) layers. However, interfacial IMC grain size increases slightly after 1.0 per cent nano-Cu added.Originality/valueThe paper demonstrates a method of nano-composite solder paste preparation by means of mechanical mixing and a comparison study of the microstructure evolution of composite solder with the basic SAC solder.
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