Abstract
The corrosion behaviors of copper under periodic wet/dry cycle conditions were investigated. The characteristics of the corrosion product formed on copper were analyzed by x-ray diffraction, scanning electron microscopy, energy-dispersive spectroscopy, and in situ electrochemical impedance spectroscopy. Weight loss results showed that the corrosion of copper under an MgCl2 deposition condition was more severe than that under NaCl. The main corrosion products formed on the tested sample under NaCl deposition condition consisted of Cu2Cl(OH)3 and Cu2O, while those under the MgCl2 deposition condition consisted of Cu2Cl(OH)3 and Mg2(OH)3Cl·4H2O. In the case of the NaCl deposition condition, a two-layered structure formed during the corrosion process. However, the corrosion product layer formed on copper under the MgCl2 deposition condition had an extremely loose structure. The effect of MgCl2 on the corrosion mechanism of copper is discussed.
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