Abstract
Tribological attributes of post-chemical mechanical planarization (CMP) brush scrubbing process were investigated as a function of type and velocity of the brush roller, applied pressure, and the pH of the cleaning solution. Coefficient of friction (COF) results were significantly different for the two types of brush rollers over a wide range of operating conditions. The two types of rollers were subjected to a battery of dynamic mechanical analyses and shown to be identical to one another in terms of flexural storage modulus and By quantifying the extent of deformation of the entire brush roller during actual scrubbing using real-time pressure sensing technology, it became apparent that for a given applied load on the brush, the less compliant brush roller (by about 10%) resulted in proportionately higher COF, thus underscoring the importance of brush design and method of mechanical testing of the roller for imparting desired amounts of shear force on the surface of the wafer during scrubbing. © 2004 The Electrochemical Society.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
