Effect of lead-free solder thermal interface material thickness on the reliability of electronic components in a random vibration environment

Abstract

The reliability of electronic components has persistently posed challenges for engineers. This study addresses the critical need of understanding the impact of random vibration on the reliability of lead-free solder as thermal interface materials (TIM) within electronic components. ANSYS software was deployed to design, develop, and simulate the electronic model, with a focus on the TIM. SAC405 lead-free solder served as the TIM, its thickness was varied between 0.01 to 0.06 mm (at 0.01 mm intervals). The results from this investigation reveal relevant correlations. As the TIM thickness increases, there's a noticeable reduction in stress and strain while the deformation increases. Remarkably, a direct relationship emerges between TIM thickness and fatigue life; thicker TIM correlates with increased fatigue life. In addition, at a TIM thickness of 0.01 mm, the fatigue life measurements were 2.76 x 104, 1.63 x 104, and 0.792 x 104 for Equations 1, 2, and 3, respectively. These findings carry profound implications for engineers, serving as a guiding framework to aid in the selection of optimal TIM thickness for electronic components if lead-free solders are used as TIM. Understanding these trade-offs between stress, strain, deformation, and fatigue life is pivotal, empowering engineers to make informed decisions during electronic system design and development, ultimately enhancing overall reliability. Using lead-free solders as TIM in electronic applications is proposed by this study due to the thermal and reliability benefits presented.