Abstract
Elevated concentrations of intermetallic compounds (IMC) in micro-solder joints adversely affect their mechanical properties. To elucidate damage evolution trends in these joints with varying IMC thicknesses under multi-field coupling, an initial IMC evolution model was formulated by employing the phase-field method. By adjusting current densities, models with diverse IMC thicknesses were generated. Experimental investigations, including IMC evolution analysis and tensile testing, determined critical damage parameters, enabling the formulation of a scalar damage model specific to micro-solder joints. Statistical analysis revealed that as IMC thickness increased, anodic damage remained confined within the IMC layer, while cathodic damage transitioned from the IMC layer to the IMC-Sn solder interface, ultimately damaging the Sn solder layer. Additionally, thicker IMC micro-solder joint models exhibited damage at lower separation displacements and encompassed larger damage areas.
Published Version
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