Abstract
Effect of In, Zn, Bi binary-metal dopings in Sn-0.7Cu (SC) solder on the electrochemical corrosion characteristics of SC solder were conducted, the potentiodynamic polarization test coupled with SEM analyses had been widely used to study the corrosion properties of alloy materials. The results showed that when both In-Zn binary-metal doping was increased, the corrosive current density (Icorr) increased, which proved that anti-corrosion capacities of Sn-0.7Cu solder decreased with In-Zn doping increasing, the affected order was Zn>In. When both In-Bi binary-metal doping percent were increased, the corrosive current density (Icorr) decreased, the affected order was In>Bi. When both Zn-Bi binary-metal doping percent were increased, the Icorr increased, the affected order was Zn>Bi. There was collaborated function on SC solder for the three metals. The synthesized result showed that the sequence of In, Bi, Zn affecting on corrosion of SC solder was that Zn>In>Bi, which provide a support data to improve soldering reliability in electronic packagings.
Published Version
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