Abstract

The horizontal magnetic field-assisted Czochralski(CZ) method is gaining significant popularity in the semiconductor industry for producing 200 mm semiconductor-grade silicon wafers. In this study, the impact of the horizontal magnetic field position on the oxygen content and radial uniformity of semiconductor-grade silicon crystals produced by the CZ method was investigated. Three-dimensional simulations were conducted using finite element software to calculate the melt convection and oxygen content before and after adjustment of the magnetic field position, respectively. The simulations results predicted a decrease in the oxygen content of the crystals following the adjustment of the magnetic field position from 0 to 75 mm below the free surface, and this was experimentally verified. The velocity distribution of the free melt surface exhibits better uniformity when lowering the magnetic field position. The influence of the magnetic field position on the temperature distribution and Marangoni flow in the melt was investigated, and the result of oxygen concentration difference identified the adjustment of the magnetic field position promoted the greater Marangoni flow below the free melt surface, which promoted the volatilization of SiO gas and thus reduced the oxygen concentration in the silicon ingot. Therefore, adjusting the position of the magnetic field is an effective way to increase the Marangoni flow and to obtain semiconductor-grade silicon crystal with lower oxygen content and better oxygen radial homogeneity.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call