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Abstract
The effect of high pressure on the microstructure of hypo-peritectic Al–38wt.%Ni alloy was studied. The results show that Al3Ni and Al3Ni2 phases coexist at ambient pressure. However, it becomes a typical hyper-eutectic microstructure when synthesized at 2 GPa and 4 GPa. Meanwhile, the interface temperature of Al3Ni and Al3Ni2 phases was calculated with the combination of the BCT dendrite growth model, which is suitable for the Al3Ni2 phase. According to the highest interface temperature principle, the result shows that the Al3Ni phase dominates over 1–5 GPa. Finally, the Debye temperature and potential energy of the hypo-peritectic Al–38wt.%Ni alloy under different pressures were researched. Based on the low temperature specific heat-capacity curve. The Debye temperatures at ambient pressure, 2 GPa, and 4 GPa are 504.4 K, 508.71 K and 515.36 K, respectively, and the potential energy in the lowest point decreases with the increase of pressure.
Highlights
Intermetallic compounds have attracted more and more attention due to their superior heat resistance, high specific strength, high thermal conductivity and high oxidation resistance, as well as superior toughness and good formability to ceramic materials [1,2,3]
There are six kinds of intermetallic compounds in the Al–Ni alloy: Al3 Ni2, Al3 Ni, Al4 Ni3, AlNi, Al3 Ni5 and AlNi3 [6,7]. It can be divided into two categories according to their solid solubility: (1) intermetallic compounds with high solid solubility, such as AlNi and Al3 Ni2 ; (2) intermetallic compounds with low solid solubility or even nil solid solubility, such as Al3 Ni
The solidification and growth characteristics of intermetallic compounds with a certain range of solid solubility can refer to the solidification of solid solution, but for intermetallic compounds with nil solid solubility, whether the constitutional undercooling criterion, dendrite tip radius, interface stability growth equation and minimum undercooling theory based on solid solution characteristics are suitable for the solidification research of nil solid solution intermetallic compound Al3 Ni and whether the final solidification microstructure will change greatly are all worth considering
Summary
Intermetallic compounds have attracted more and more attention due to their superior heat resistance, high specific strength, high thermal conductivity and high oxidation resistance, as well as superior toughness and good formability to ceramic materials [1,2,3]. While among these intermetallic compounds, the Al–Ni series is one of the most important and promising candidate high-temperature materials [4,5]. There are six kinds of intermetallic compounds in the Al–Ni alloy: Al3 Ni2 , Al3 Ni, Al4 Ni3 , AlNi, Al3 Ni5 and AlNi3 [6,7]. The Al–Ni alloy with hypo-peritectic composition was selected
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