Abstract
Flexible printed circuits (FPC) are generally used to assemble electronics units of mobile phones and the other electronics devices. On the recycling of the waste FPC, separation of the layered components in metal substrates, mounted parts and resin films covering printed wire is important for the effective recovery of precious metals and the other elements. However, there are difficulties on their recycle due to their flexible features that prevent to break down themselves against the impaction force of conventional breaking methods. In this study, frequent shearing forces were applied for the waste FPC chips by making use of attrition type milling. The FPC chips were ground and separated into flakes and powders. As results, some elements were selectively separated. 90mass% of Cu was recovered in the flakes on 1mm sieve. On the contrary, almost of Pd was collected in the powder under 1mm sieve.
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