Effect of gas mixing ratio on etch behaviors of Ba 2Ti 9O 20 (BTO) and Pt thin films in Cl 2/Ar inductively coupled plasma

Abstract

An investigation of the Ba 2Ti 9O 20 (BTO) and Pt thin films etch mechanism in the Cl 2/Ar inductively coupled plasma was carried out. It was found that an increase in Ar mixing ratio at fixed gas pressure and input power causes a fast decrease in the BTO etch rate (26.9–1.2 nm/min for 0–100% Ar) while the Pt etch rate increases slightly from 17.4–23.0 nm/min. Langmuir probe diagnostics and zero-dimensional plasma modeling provided the data on plasma parameters, steady-state composition and fluxes of active species on the etched surface. From the model-based analysis of etch kinetics, it was shown that the behavior of the BTO etch rate corresponds to the reaction-rate-limited etch regime, where the etch rate is limited neither by physical sputtering of the main material nor by the ion-stimulated desorption of low-volatile reaction products. The etch process of Pt appears in the transitional regime and is controlled by the neutral and ion fluxes together.