Abstract
This paper investigated the effect of different types of fluxes on the wettability of a type of low temperature lead-free solder, 60Sn-40Bi alloy. The purpose of this paper is to investigate the effect of different types of fluxes on the wettability of 60Sn-40Bi solder (Tm : 138 -170 oC), so that the most compatible flux to be used with low temperature alloy can be determined.The results of this paper showed that the water soluble flux sample has the highest spread area and lowest contact angle. This meant that the solder has the highest wettability when water soluble flux is used, followed by RMA flux and low solids flux. Therefore, it was determined that water soluble flux is the most compatible to be used with the low temperature 60Sn-40Bi solder. The characteristic of this type of flux enables it to function well even at a low working temperature.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IOP Conference Series: Materials Science and Engineering
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
