Abstract
In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn 3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow soldering. They were further aged at 125°C and 150°C for up to 1000 hours. Results showed that fluxes significantly affect the IMC thickness and growth. In addition, during aging, the scallop and columnar morphology of IMC changed to a more planar type for both type of flux during isothermal aging. It was observed that the growth behavior of IMC was closely related to initial soldering condition.
Highlights
Nowadays, there are huge demand in multifunction of electronics products
Most of the researchers were investigating on the wetting properties of solder alloy with respect to flux type or materials, but none of them were looking at the effect of flux type towards intermetallic compound (IMC) formation and growth after reflow soldering and isothermal aging
The detail explanation of the wetting characteristics was explained in elsewhere [6, 7]. This phenomena can be summarized as follow; whenever the flux was exposed to reflow temperature, some of Flux B begins to thermally decomposed due to its different composition, and activating the diffusion reaction between solder alloy and copper substrate
Summary
There are huge demand in multifunction of electronics products To produce such products, it requires a larger number of input and output data which can be obtained through a good solder joint connection [1,2,3]. It is used to clean and activate the subtrate surface by forming a continuous film over the surface that inhibits access oxygen to the substrate It can be wetted by the molten solder. The solid solder or flux and molten solder/flux interfacial tensions differ with respect to flux type, composition and temperature This condition will affect the type of IMC formed after reflow soldering since it encounters reaction between the solder and substrate [6, 7]. Different type of IMC leads to different solder joint strength
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