Abstract
Heat sink fins arrangement are important in heat management in microelectronics devices because it helps in the dissipation of heat from the chip level device to the environment and provide an efficiently working device. In this light, investigation was conducted on the effect of fins arrangement on thermal performance in microelectronics devices using the ANSYS finite element design software. The results obtained showed a maximum temperature range of between 95.27 – 126.79 o C, thermal resistance of 1.2 – 1.8 K/W, and thermal efficiency of 15 – 37%. The results demonstrated that, the arrangement of heat sink fins largely affects the thermal resistances and efficiencies of the microelectronic device. In addition, the A1 rectangular fins arrangement exhibited better thermal capabilities over the other fins arrangements investigated. This research can aid the development of future heat sinks to accommodate customer demands. Keywords : heat transfer; fin arrangement; microelectronics
Highlights
Heat management in small electronic packages has become a serious problem in microelectronics industries
The fins around the centre of the heat source will have the maximum temperature recorded amongst the other fins
The steady state thermal analyses of a flat plate heat sink was investigated focusing on the rectangular fins arrangement
Summary
Heat management in small electronic packages has become a serious problem in microelectronics industries This is as a result of the excessive heat generated by power packed devices. Consumers keeps demanding efficient and portable devices which in turn increases the heat dissipation of the devices Researchers such as (Ekpu et al 2011; Wan et al 2011) have reported on devices that can be used to effectively remove the excess heat generated by the electronic devices. The numerical results gotten by Maveety and Jung (2002) demonstrated similar relationship with experimental results This investigation is centred on the effect of fins arrangement on thermal performance in microelectronics devices. This research is aimed at analysing different heat sink arrangements in a single study
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