Abstract
Heat sinks are commonly used for the dissipation of heat in microelectronics packages. The choice of optimal heat sinks configuration largely depends on the market demand and thermal performance. Hence, having the right heat sinks configuration is vital to the overall thermal durability of the microelectronics package. This paper investigates the thermal resistance and efficiency of heat sink fins geometry in microelectronics application. This study investigates the shapes of six (square, rectangular, triangular, hexagonal, circular, and elliptical) different heat sink fins on thermal performance. ANSYS finite element design software was used to create the 3D models and meshed between 5-20% of the initial mesh size. Transient thermal conduction analysis was used in analysing the heat sinks. The results obtained demonstrated that the more number of elements in the mesh (or the finer the mesh) the better the convergence of the numerical solution. The results also showed that the rectangular shaped heat sink fins exhibited better thermal capabilities than the other shaped fins, by having a maximum temperature of about 42.5oC, thermal resistance of about 0.244 K/W, and thermal efficiency of about 50%.Keywords: heat sink; fin geometry; thermal resistance
Highlights
Managing heat in microelectronics applications is crucial to the overall reliability of the electronics system
Several researchers have studied the heat transfer of different heat sink configurations in the open literature and a few of such research findings will be presented in this paper
The present study focused on thermal conduction of different shapes of heat sinks fins
Summary
Managing heat in microelectronics applications is crucial to the overall reliability of the electronics system. Several researchers have studied the heat transfer of different heat sink configurations in the open literature and a few of such research findings will be presented in this paper. Yang and Peng (2008) researched on numerical study of pinfin heat sink with un-uniform fin height design. In another study, Maveety and Jung (2000) investigated the design of an optimal pin-fin heat sink with air impingement cooling. In the following references (Yang and Peng, 2009; Maveety and Jung, 2002; Kreutz, 2000; Luo et al, 2009; Kulkarni and Das, 2005), more information on the role of heat sinks and their configurations in the transfer of heat in microelectronics applications are recorded. The present study focused on thermal conduction of different shapes of heat sinks fins. This research is aimed at comparing different heat sink geometries in a single investigation
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