Effect of filling level and fillet profile on pin-through-hole solder joint

Abstract

This study investigates the effects of filling level and fillet profile on a solder joint strength between pin-through hole (PTH) and a printed circuit board. The influences of filling level and fillet profile on deformation, von Mises stress and strain are the focus of this research. Five filling levels (20%, 40%, 60%, 80% and 100%) and fillet profiles (0.2, 0.4, 0.6, 0.8 and 1.0) are considered. The Abaqus software is used to examine the PTH structure. A tension test experiment is conducted on a single PTH connector, and its results are compared with the simulation results. The simulation and experimental results show an almost identical linear trend with an average discrepancy of 3.39%. Results show that an increase in the filling level and the fillet profile increases the structural deformation/displacement and the von Mises stress. The displacement and the von Mises stress of the PTH exhibit a linear correlation with the filling level and the fillet profile. This study is expected to provide a good understanding of solder joint strength during wave soldering.