Implications of Adjustable Fountain Wave in Pin Through Hole Soldering Process

Abstract

This paper presents the implications of the adjustable fountain wave soldering process during pin through hole (PTH) component assembly process. The PTH vertical fill was carried out experimentally by using a newly developed adjustable fountain wave soldering machine (\({0^{\circ}}\) conveyor angle). A similar printed circuit board and components were assembled by using a conventional wave soldering machine (\({6^{\circ}}\) conveyor angle). This paper focuses on vertical filling by using both wave soldering methods. A non-destructive X-ray computed tomography scanning machine was employed to inspect the vertical fill of each PTH. The percentage of the vertical fill for two different wave soldering machines was analyzed. The PTH filling phenomenon during wave soldering was also discussed. FLUENT software was utilized to simulate the PTH vertical filling of adjustable fountain wave soldering. The volume of fluid model tracked the flow front of the molten solder. The simulation and experimental results showed a nearly identical solder filling profile. The void of the PTH vertical filling was also visualized under an X-ray CT scanning machine.