Abstract
Considering the grit aggregation of fixed abrasive and the environmental pollution of free abrasive machining tools, a kind of ultra-fine abrasive polishing pad was fabricated by means of sol-gel technology. The effects of drying method, gel reaction time, sodium alginate concentration and pad thickness which determine the property of the polishing pad were respectively investigated. And the polishing pad fabricated under the optimized condition was utilized to polish silicon wafer on a nano-polishing machine to evaluate the tool performance.
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