Abstract
The number of the dummy via can significantly affect the interconnect average temperature. This paper explores the modeling of the interconnect average temperature in the presence of multiple dummy vias. The proposed model incorporates the multi-via effect into the effective thermal conductivity of the interlayer dielectric (ILD) to obtain accurate results. Using different ILDs, the multi-via effect is analyzed and discussed. Also, the extended applications of the multi-via effect are presented in this paper to obtain the minimum interconnect average temperature increase with a given via separation or number. This study suggests that the multi-via effect should be accounted for in integrated circuits design to optimize the performance and design accuracy of integrated circuits.
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