Abstract
Diamond-copper composites are fabricated by spark plasma sintering (SPS). The effects of particle size, original properties and coatings of diamond on the thermal conductivity (TC) of diamond-copper composites have been investigated, respectively. The results indicate that thermal conductivity of composites enhances with an increase in particle size and original properties of diamond. Composites with Cr, Ti or Ni coatings on diamond surface appear remarkably higher TC than that which without any coatings. The improvements of TC of diamond/copper composites are mainly due to the large particle size diamond decreasing the interfacial area in composites, the high original properties diamond possessing higher original TC, and coatings on diamond surface declining the interfacial thermal resistance and improving the wetting properties between diamond and copper.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
