Abstract
Ti-Mg immiscible alloy thin films were prepared using a multi-arc ion plating technique with various deposition parameters. The surface and cross-section morphologies, crystal structures, and chemical compositions of the Ti-Mg films were investigated by scanning electron microscopy (SEM), X-ray diffraction (XRD), and transmission electron microscopy (TEM). The influence of the substrate negative bias voltage and Ar gas pressure on the microstructure of the Ti-Mg films was systematically studied. Mg atoms were incorporated into the Ti lattice to form an FCC immiscible supersaturated solid solution phase in the thin film. Microparticles were observed on the film surface, and the number of microparticles could be significantly reduced by decreasing the substrate bias voltage and increasing the Ar gas pressure. The appropriate substrate bias voltage and Ar gas pressure increased the deposition rate. The TEM results indicated that columnar, nanolayer, and equiaxed nanocrystals were present in the thin films. Ti and Mg fluctuations were still evident in the nanoscale structures.
Highlights
Compared with traditional metallic biomaterials, the heavier element (Ti)-Mg binary alloys have become promising biomedical materials for orthopedic implant applications due to various properties [1]
The results demonstrated that a negative bias voltage in the multi-arc ion plating process could facilitate the mixing of the immiscible Ti and Mg elements
The deposited Ti-Mg films were composed of face-centered cubic (FCC) Ti-Mg supersaturated solid solution, hexagonal close-packed (HCP) Ti, and HCP Mg phases
Summary
Compared with traditional metallic biomaterials (such as Co-Cr alloy and 316L stainless steel), Ti-Mg binary alloys have become promising biomedical materials for orthopedic implant applications due to various properties [1]. Previous studies demonstrated that non-equilibrium techniques, such as mechanical alloying [15,16] and physical vapor deposition (PVD) [17], can greatly increase the solid solubility of Mg in Ti, forming metastable. Studies on the synthesis of Ti-Mg immiscible alloy thin films by magnetron sputtering deposition [21,22] or plasma immersion ion implantation [23] have been reported. Few studies on the preparation of Ti-Mg alloy thin films using the multi-arc ion plating (MAIP) process have been reported. Ti-Mg immiscible alloy thin films were deposited by the MAIP process. The effects of the deposition parameters, including the substrate negative bias, coating vacuum, on the microstructural evolution of the Ti-Mg immiscible alloy thin films were investigated
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