Abstract
AbstractPolymer materials have been used extensively as the organic substrate materials in electronic packaging industry. The mechanical, thermal, and morphology properties of the alternative low cost composites have been investigated in this article. One of the materials is epoxy resin cured by aliphatic amine, and the other is cured by aromatic amine. It was found that the physical, mechanical, and thermal properties of epoxy resins are strongly depended on the curing agents. Morphology changed differently in these two epoxy‐curing systems. Crosslink density obtained from rubbery modulus in dynamic flexural storage modulus showed aromatic amine functionality group that gives higher crosslink density and increased in physical, mechanical, and thermal properties. POLYM. COMPOS., 29:27–36, 2008. © 2007 Society of Plastics Engineers
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