Effect of Cu addition on whisker formation in tin-rich solder alloys under thermal shock stress

Abstract

This article focuses on the influence of thermal shocks and Cu addition on tin whiskers growth on the surface of tin-rich materials and alloys. The tests were carried out on real samples manufactured with classical PCB technology. Four Pb-free materials i.e. pure Sn, Sn99Cu1, Sn98Cu2 and Sn97Cu3 were tested from the point of view of susceptibility to whisker formation after thermal shocks. Results show that all tested materials were prone for whisker formation. Copper addition in coexistence with thermal shocks did not promote the growth of filament-like whiskers.