Abstract
An experimental investigation of the dependence of thermal impedance on a variety of typical design parameters including component arrangement, powering configuration, board placement, system orientation, and cooling mode is described. Some concepts of board and regional thermal impedances are introduced and the utility of these measures for performance comparison, data analysis, modeling, and design extrapolation is illustrated. A component-level energy balance is proposed to predict measured changes in peak component temperatures as a function of power level and location of neighboring components. Neighboring-component effects can increase effective junction to ambient thermal impedance by more than 25%. Measured heat transfer coefficients are compared to previously published values. The design issues of correcting for neighboring-component effects and utilizing the concept of regional thermal impedances are explored. A standardized portable database suitable for numerical model validation is described. >
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
