Abstract
X-ray tomography was used to monitor damage evolution in nano-silver sintered joints during thermal cycling. Samples consisted of a silicon die joined to a direct bond copper substrate by sintering nano-silver paste. The amount of observable damage was significantly affected by the amount of allowable warping during the thermal cycling tests. By fully constraining the sample from flexing during thermal cycling, all observable damage was eliminated.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
