Abstract
We investigated the degradation of indium-gallium-zinc-oxide (IGZO) thin-film transistors (TFTs) for various channel widths under high-gate and drain bias stress. The threshold voltage of IGZO TFT with wide-channel width (W > 100 μm) was significantly shifted. This included stress-induced hump-effect in a negative direction after the stress, whereas IGZO TFT with narrow-channel width (W < 100 μm) shifted in a positive direction. This phenomenon may be attributed to the hole trapping into the back-interface region. In order to enhance the reliability of IGZO TFTs, we developed and verified that the multiple-channel device showed better bias-temperature stability (ΔVTH: −0.1 V), whereas the single-channel device exhibited a −0.4 VΔVTH shift.
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