Effect of bell annealing on the interface microstructure and mechanical properties of titanium/steel composite plates prepared by hot rolling

Abstract

This study investigates the effect of bell annealing (600°C-750°C/3 h-15 h) on the interfacial microstructure and mechanical characteristics of hot-rolled titanium/steel (Ti/steel) bi-metallic plates, aiming to improve their mechanical performance and deformation compatibility. The interfacial bonding mechanism and growth process of the interfacial TiC layer were studied using multi-scale characterization. The microstructural evolution during annealing and the effect of the TiC layer on element interdiffusion were considered. Results show that the TiC interlayer inhibits Ti and Fe diffusion, preventing undesirable Ti-Fe phases, and the TiC layer thickens towards the Ti side. Higher annealing temperatures and longer times worsened the grain size difference between the Ti and steel layers and produced a thick TiC layer, severely degrading deformation compatibility. Microcracks, caused by severe lattice mismatch, are mostly initial at the α-Fe/TiC interface during plastic deformation. Thin to moderate TiC layers resulted in a combination of ductile and brittle fractures, while thick layers led to brittle fractures. In terms of mechanical properties, the ultimate tensile strength (UTS), yield strength (YS), shear strength, and elongation (EL) of the hot-rolled composite plate were measured at 337 MPa, 232 MPa, 238 MPa, and 29%, respectively. All annealed samples exhibited a reduction in UTS, YS, and shear strength compared to the hot-rolled state; however, they demonstrated improved elongation and deformation compatibility, with the elongation achieving its optimal value at 650°C-3 h. The annealing, at 650°C for 3 h, was identified as the optimal condition for post-rolling heat treatment, resulting in a composite plate with a comprehensive mechanical performance characterized by UTS, YS, shear strength, and EL values of 267 MPa, 127 MPa, 171 MPa, and 46%, respectively.