Abstract
Three plating baths (Sn–Cu, Sn–Bi and Sn–Ag–Cu) containing a polyoxyethylene laurylether (POELE) additive were developed as Pb-free solder plating solutions. The addition of POELE afforded a smooth, homogeneous alloy upon deposition. A mechanism for the effect of POELE in the electrodeposition process is proposed in which POELE adsorbs on deposited Sn surfaces, suppressing subsequent deposition during electrolysis. The POELE remains on the surface of the deposited Sn as the plating layer grows, and is efficiently removed in the final water rinse.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
