Editorial

Abstract

Quality and Reliability Engineering InternationalVolume 10, Issue 4 p. 253-253 EditorialFree Access Editorial N. Labat, N. Labat IXL—(URA 846-CNRS) University of Bordeaux 351 Cours de la Libération 33405 Talence, FranceSearch for more papers by this authorA. Touboul, A. Touboul IXL—(URA 846-CNRS) University of Bordeaux 351 Cours de la Libération 33405 Talence, FranceSearch for more papers by this author N. Labat, N. Labat IXL—(URA 846-CNRS) University of Bordeaux 351 Cours de la Libération 33405 Talence, FranceSearch for more papers by this authorA. Touboul, A. Touboul IXL—(URA 846-CNRS) University of Bordeaux 351 Cours de la Libération 33405 Talence, FranceSearch for more papers by this author First published: 1994 https://doi.org/10.1002/qre.4680100402AboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL No abstract is available for this article. References 1 A. Birolini, Quality and Reliability of Technical Systems, Springer Verlag, Berlin, 1994. 2 W. Gerling, Integration of efforts for the reliability of microelectronic devices, Quality and Reliability Engineering International, 10, 255– 261 (1994) — this issue. 3 J. F. Verweij, A. C. Brombacher and M. M. Lunenborg, ‘Component lifetime modelling,’ Quality and Reliability Engineering International, 10, 263– 271 (1994) — this issue. 4 C. Russ, H. Gieser, P. Egger and S. Irl, ‘Compact electrothermal simulation of ESD-protection elements’, Quality and Reliability Engineering International, 10, 335– 340 (1994) — this issue. 5 J. R. Lloyd, ‘Reliability modelling for electromigration failure’, Quality and Reliability Engineering International, 10, 303– 308 (1994) — this issue. 6 W. Claeys, V. Quintard, S. Dilhaire, D. Lewis and Y. Danto, ‘Early detection of ageing in solder joints through laser probe thermal analysis of the Peltier effect’, Quality and Reliability Engineering International, 10, 289– 295 (1994) — this issue. Volume10, Issue41994Pages 253-253 ReferencesRelatedInformation