Edge chipping resistance of ceramics bonded to a dentine analogue

Abstract

ObjectiveTo evaluate the edge chip resistance (ReA) of two CAD/CAM monolithic ceramics (GC- IPS e.max CAD and YZ- Zenostar Zr Translucent) bonded to a dentine analogue substrate (G10- NEMA G10). MethodsPlate-shaped specimens were prepared from GC and YZ ceramics and were either bonded (B) to G10 or attached (NB) to a universal testing machine for edge chipping test. Samples from all groups (GC-B, GC-NB, YZ-B and YZ-NB) were indented (n = 25) at different edge distances (d = 0.1, 0.2, 0.3, 0.4, 0.5 and 0.6 mm) to produce chips. Force (F, in N) and d values were recorded and ReA (in N/mm) were calculated. Data were statistically analyzed using Pearson´s correlation, Student t, ANOVA and Tukey tests (α = 0.05). ResultsA strong correlation (R ≥ 0.98) was found between F and d values for all groups. ReA values increased with increasing d, irrespective of ceramic type (GC and YZ) or fixation method (B and NB). Significant differences (p < 0.05) in mean ReA values were found between B and NB ceramics at lower d (0.1–0.3 mm) that did not persist (p > 0.05) at greater d (0.5 and 0.6 mm), meaning, bonding (B) to G10 protected both materials against chipping close to the edge. ConclusionsThe larger the distance from the occlusal contact to the restoration edge, the greater the chance to avoid ceramic chipping in monolithic restorations. For d ≤ 0.3 mm, such F vs d relation is less critical for edge resistance of YZ and for resin bonded monolithic ceramics.