Abstract
Multilayer thick film hybrids are sometimes fabricated without adequate concern for their economics. Economy begins in design; it can suffer in processing and be lost in test and assembly: This paper treats some of the cost considerations applied to a large family of multilayer hybrids for use in computer equipment. Design rules for good yields are presented. Some materials selection and processing criteria are discussed. Paste consumption data, screen wear, and substrate yield experience, is given. An arrangement for automated electrical substrate testing is described. A mechanized process for silicon circuit chip attachment and connection is also described.
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