Abstract
The approach method to investigate boiling heat transfer mechanism with MEMS (Micro-Electro-Mechanical systems) sensor has been developed. The MEMS sensor includes trigger electrode and eight thin film thermocouples on the top side of a silicon substrate and two thin film heaters on the back side. In the experiment, Temperature variation beneath an isolated bubble during nucleate boiling of water was measured with the sensor. Measured temperature data presents formation and strong evaporation of microlayer and expansion of dry-out area in bubble growth process and rewetting of the dry-out area in bubble departure process. Additionally, heat transfer from the heated surface was evaluated by transient heat conduction analysis with the measurement data as a boundary condition. As the result, it was indicated microlayer evaporation contributed to surface heat transfer predominantly.
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