Abstract
Abstract This paper focuses on the two-layer RIE PCM system [1] using both DUV and E-Beam exposures. An organosilicon polymer (SNR M2 from TOYO SODA) serves as top image resist and is spin coated over a thick crosslinked novolak layer (HPR 204). This system allows a very high aspect ratio image to be attained which is an essential characteritic for obtaining high resolution.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
