Abstract

A dynamic slingshot pull-in operation is presented by using the influence of inertia and damping on the nanoelectromechanical (NEM) memory switch operation. To confirm the validity of the proposed idea, a finite element analysis (FEA) simulation, that reflects the actual cantilever beam structure, is performed, and an analytical one-dimensional (1D), the parallel plate model is tested. According to the analytical and FEA data, the dynamic slingshot pull-in voltage can be achieved ~0.78 times and ~0.73 times lower than conventional pull-in voltage under near-vacuum conditions, respectively. It is also shown that the proposed dynamic slingshot operation is more effective for lowering operation voltage ( $V_{\mathrm {DD}}$ ) and boosting the chip density of complementary-metal-oxide-semiconductor (CMOS)- NEM hybrid reconfigurable logic (RL) circuits than the static slingshot operation.

Highlights

  • Conventional complementary-metal-oxide-semiconductoronly (CMOS-only) reconfigurable logic (RL) circuits, a well-known example of which is a field-programmable gate array (FPGA), suffer from some fundamental limitations including, low chip density, high energy consumption, and low speed [1], [2]. These limitations mainly stem from the fact that routing blocks (RBs) that determine data signal paths consist of CMOS devices horizontally integrated on a silicon substrate suffering from high leakage current and high resistance

  • It should be noted that the VDD of the NEM memory switch reaches the sub-1 V region, which is lower than the VDD of the 65 nm CMOS node using the proposed dynamic slingshot operation

  • It is confirmed that the proposed dynamic slingshot operation is superior to conventional pull-in and static slingshot operations in terms of VDD and size reduction

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Summary

Introduction

Conventional complementary-metal-oxide-semiconductoronly (CMOS-only) reconfigurable logic (RL) circuits, a well-known example of which is a field-programmable gate array (FPGA), suffer from some fundamental limitations including, low chip density, high energy consumption, and low speed [1], [2]. This study proposes a dynamic slingshot operation for further reduction of Vp, which eventually lowers the overall VDD of M3D CMOS-NEM hybrid RL circuits. 2(b) and 2(c) compare the proposed dynamic slingshot operation with the previous static one of a NEM memory switch.

Results
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